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DF-2005 Dry-Film Negative Photo Resist offers moderate modulus of 4.5 GPa at 25°C. Unit is suitable for micro-electro mechanical systems, wafer-level packaging and CMOS applications. Product provides resistance to moisture conditions and corrosive chemicals. DF-2005 film can be used with EMS line of spin-coatable photoresists.
Read More »DF-2005 Dry-Film Negative Photo Resist offers moderate modulus of 4.5 GPa at 25°C. Unit is suitable for micro-electro mechanical systems, wafer-level packaging and CMOS applications. Product provides resistance to moisture conditions and corrosive chemicals. DF-2005 film can be used with EMS line of spin-coatable photoresists.
Read More »Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
DELAWARE, OH - July 2016 - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline...
Read More »Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
DELAWARE, OH - July 2016 - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline...
Read More »Dry Film Negative Photoresist suits MEMS/CMOS applications.
DELAWARE, OH -- Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll...
Read More »Dry Film Negative Photoresist suits MEMS/CMOS applications.
DELAWARE, OH -- Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll...
Read More »Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...
Read More »Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...
Read More »Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
DELAWARE, OH – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar...
Read More »Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
DELAWARE, OH- – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar...
Read More »DF-2005 Dry-Film Negative Photo Resist offers moderate modulus of 4.5 GPa at 25°C. Unit is suitable for micro-electro mechanical systems, wafer-level packaging and CMOS applications. Product provides resistance to moisture conditions and corrosive chemicals. DF-2005 film can be used with EMS line of spin-coatable photoresists.
Read More »DF-2005 Dry-Film Negative Photo Resist offers moderate modulus of 4.5 GPa at 25°C. Unit is suitable for micro-electro mechanical systems, wafer-level packaging and CMOS applications. Product provides resistance to moisture conditions and corrosive chemicals. DF-2005 film can be used with EMS line of spin-coatable photoresists.
Read More »Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
DELAWARE, OH - July 2016 - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline...
Read More »Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
DELAWARE, OH - July 2016 - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline...
Read More »Dry Film Negative Photoresist suits MEMS/CMOS applications.
DELAWARE, OH -- Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll...
Read More »Dry Film Negative Photoresist suits MEMS/CMOS applications.
DELAWARE, OH -- Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll...
Read More »Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...
Read More »Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...
Read More »Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
DELAWARE, OH – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar...
Read More »Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
DELAWARE, OH- – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar...
Read More »