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Engineered Material Systems

132 Johnson Dr., Delaware, OH, 43015, US

Sales:
Mark Francis
Global Sales and Marketing Manager
USA
Phone: 740-203-2950
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Latest New Product News from
Engineered Material Systems

Materials & Material Processing

Negative Photoresist offers chemical and moisture resistance.

August 25, 2015

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. With glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C, DF-3050 is less brittle than most other negative photoresists. Read More

Adhesives & Sealants, Green & Clean, Electronic Components & Devices

Conductive Adhesive is used for stringing solar modules.

July 22, 2015

Intended for stringing applications in crystalline silicon and thin-film solar modules, EMS 561-403 Snap Cure Conductive Adhesive is designed to electrically interconnect solar cells using ribbons. Stress-absorbing adhesive withstands thermal cycling effects and exhibits conductive stability to cell and ribbon metallization during damp heat exposure. Ability to cure within seconds at 180°C or above accelerates fixturing of cells in stringer. Read More

Adhesives & Sealants

Conductive Adhesive suits solar modules applications.

May 21, 2015

Intended for stringing or shingling crystalline silicon and thin-film solar modules, EMS 561-147-2 electrically interconnects solar cells using ribbons or direct cell to cell contact. Stress absorbing capabilities withstand effects of thermal cycling, and other features include conductive stability to cell and ribbon metallization during damp heat exposure. Curing within seconds at 180°C or above, adhesive enables accelerated fixturing of cells in stringer. Read More

Adhesives & Sealants

Conductive Adhesive features low-temperature cure.

May 7, 2015

Designed for die attach and general circuit assembly applications, CA-180 cures in 30 min at 80°C, 3 min at 100°C or 10 sec at 150°C with electrical conductivity of 4 x 10-5 ohm-cm. This low-temperature cure conductive adhesive has 48 hr work life and 12,000 cP viscosity at 5 rpm for facilitated needle dispensing or application by pin transfer. Applications include those where components are temperature-sensitive and require high conductivity interconnects.

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Adhesives & Sealants

UV Cure Adhesive suits circuit assembly applications.

April 27, 2015

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony. Read More

Adhesives & Sealants

UV-Cured Epoxy Adhesive increases electronic assembly reliability.

January 28, 2015

Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Read More

Materials & Material Processing

Dry-Film Negative Photoresist suits MEMS, wafer applications.

January 9, 2015

Optimized for hot roll lamination and processing on micro electro mechanical systems (MEMS) and IC wafers, DF-3020 comes in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments, including extreme moisture and corrosive chemicals; glass transition temperature is 158°C; and moderate modulus is 3.5 GPa at 25°C. Suited for MEMS and wafer-level packaging applications (TSV sealing), hydrophobic product can be used in contact with EMS spin coatable photoresists. Read More

Materials & Material Processing

Dry Film Negative Photoresist produces hydrophobic surfaces.

May 14, 2014

Optimized for hot roll lamination and processing on micro-electromechanical systems (MEMS) and IC wafers, DF-4017 produces hydrophobic (>90° contact angle) film surfaces. Cured chemistry withstands harsh environments, including those subject to moisture and corrosive chemicals, while glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C lend to toughness. Product is compatible with and can be used in contact with EMS spin coating photoresist. Read More

Adhesives & Sealants

UV Cure Adhesive suits microelectronic assembly applications.

April 8, 2014

Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony. Read More

Adhesives & Sealants, Health, Medical and Dental Supplies & Equipment

Conductive Adhesive targets die-attach applications.

February 19, 2014

Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules. Read More

Adhesives & Sealants

Epoxy Adhesive suits microelectronic assembly applications.

January 14, 2014

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Read More

Adhesives & Sealants

Conductive Adhesive suits die attach applications.

January 10, 2014

Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Read More

Materials & Material Processing

Dry Film Negative Photoresist targets MEMS applications.

November 6, 2013

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 µm thickness, ±1 µm and can be manufactured from 5–25 µm thick. Film features glass transition temperature of 165°C and moderate modulus of 4 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. Read More

Adhesives & Sealants

Conductive Adhesive is intended for solar cell applications.

September 16, 2013

Intended for back contact applications in crystalline silicon solar modules, DB-1588-3 is stress absorbing to withstand thermal cycling effects and features conductive stability to back contact metallizations during damp heat exposure. Adhesive specifically makes contact from vias or other conductors on solar cells to back contact sheet and is designed to cure through encapsulant lamination and cure process. Read More

Adhesives & Sealants

LED Die Attach Adhesive exhibits high thermal conductivity.

September 12, 2013

Used for attaching LED and other small semiconductor die to silver and copper lead frames, CA-195 has dispense open time of >24 hr (measured as 25% increase in viscosity) while maintaining optimized rheology for pin transfer or needle dispensing. Electrically conductive solution features glass transition temperature (Tg) that facilitates wire bonding small die, low extractable ionics as well as adhesion to silver and copper lead frames.
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Adhesives & Sealants, Green & Clean

Jettable Conductive Adhesive is suited for PV stringing, bussing.

July 2, 2013

Intended for ribbon stringing and bussing in photovoltaic (PV) applications, CA-148 Jettable Electrically Conductive Adhesive features moderate glass transition temperature (Tg) and modulus. Formula has optimized rheology for jet dispensing and is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Read More

Test & Measuring Instruments, Computer Hardware & Peripherals, Machinery & Machining Tools, Materials & Material Processing, Services

Negative I-Line Photoresist has hydrophobic cured chemistry.

June 25, 2013

With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance to moisture and corrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165°C and moderate modulus of 4.5 GPa at 25°C. NR series comes in solids/viscosities that achieve 2–40 µm thickness in single layer. Read More

Adhesives & Sealants

UV Cure Adhesive suits microelectronic assembly applications.

May 31, 2013

Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 is also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not contain antimony. Product offers minimal stress, shrinkage, and glass transition temperature values.

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Adhesives & Sealants

Conductive Adhesive targets back contact solar modules.

May 8, 2013

Designed to make contact from vias or other conductors on crystalline silicon solar cells to back contact sheet, DB-1588-2 Conductive Adhesive is stress absorbing to withstand rigors of thermal cycling. Product features optimal conductive stability to back contact metallizations during damp heat exposure, and is designed to cure through encapsulant lamination and cure process. Read More

Materials & Material Processing

Dry Film Negative Photoresist is designed for MEMS.

April 16, 2013

Optimized for hot roll lamination and processing on Micro-Electro-Mechanical Systems (MEMS) and IC wafers, DF-1014 comes in various thickness formats from 5–50 µm, ±5% and features glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C. Exhibiting resistance to extreme moisture conditions and corrosive chemicals, cured chemistry can withstand harsh environments. Material formulation is compatible and can be used in contact with EMS spin coatable photoresists. Read More

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Engineered Material Systems