Company News

Engineered Material Systems

132 Johnson Dr., Delaware, OH, 43015, US

  • 740-362-4444

Sales:
Mark Francis
Global Sales and Marketing Manager
USA
Phone: 740-203-2950
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Latest New Product News from
Engineered Material Systems

Materials & Material Processing

Dry Film Negative Photoresist produces hydrophobic surfaces.

May 14, 2014

Optimized for hot roll lamination and processing on micro-electromechanical systems (MEMS) and IC wafers, DF-4017 produces hydrophobic (>90° contact angle) film surfaces. Cured chemistry withstands harsh environments, including those subject to moisture and corrosive chemicals, while glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C lend to toughness. Product is compatible with and can be used in contact with EMS spin coating photoresist. Read More

Adhesives & Sealants

UV Cure Adhesive suits microelectronic assembly applications.

April 8, 2014

Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony. Read More

Adhesives & Sealants, Health, Medical and Dental Supplies & Equipment

Conductive Adhesive targets die-attach applications.

February 19, 2014

Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules. Read More

Adhesives & Sealants

Epoxy Adhesive suits microelectronic assembly applications.

January 14, 2014

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Read More

Adhesives & Sealants

Conductive Adhesive suits die attach applications.

January 10, 2014

Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Read More

Materials & Material Processing

Dry Film Negative Photoresist targets MEMS applications.

November 6, 2013

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 µm thickness, ±1 µm and can be manufactured from 5–25 µm thick. Film features glass transition temperature of 165°C and moderate modulus of 4 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. Read More

Adhesives & Sealants

Conductive Adhesive is intended for solar cell applications.

September 16, 2013

Intended for back contact applications in crystalline silicon solar modules, DB-1588-3 is stress absorbing to withstand thermal cycling effects and features conductive stability to back contact metallizations during damp heat exposure. Adhesive specifically makes contact from vias or other conductors on solar cells to back contact sheet and is designed to cure through encapsulant lamination and cure process. Read More

Adhesives & Sealants

LED Die Attach Adhesive exhibits high thermal conductivity.

September 12, 2013

Used for attaching LED and other small semiconductor die to silver and copper lead frames, CA-195 has dispense open time of >24 hr (measured as 25% increase in viscosity) while maintaining optimized rheology for pin transfer or needle dispensing. Electrically conductive solution features glass transition temperature (Tg) that facilitates wire bonding small die, low extractable ionics as well as adhesion to silver and copper lead frames.
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Engineered Material Systems