Advanced Power Technology

Electrical Equipment & Systems

Microsemi Strengthens Radiation-Hardened Aerospace Products Portfolio

Delivers Industry's First 120V Input, 50W High-reliability DC-DC Converter Modules ALISO VIEJO, Calif., Nov. 1, 2011 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it strengthened its portfolio of radiation-hardened products with the industry's first family of 120 volt, 50...

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Electrical Equipment & Systems

Microsemi Strengthens Radiation-Hardened Aerospace Products Portfolio

Delivers Industry's First 120V Input, 50W High-reliability DC-DC Converter Modules ALISO VIEJO, Calif., Nov. 1, 2011 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it strengthened its portfolio of radiation-hardened products with the industry's first family of 120 volt, 50...

Read More »
Agricultural & Farming Products

Customizable SoCs come in chip scale packages.

Catering to miniaturization needs of embedded systems, SmartFusion-® cSoC Series is available in CS288 288-ball chip scale package measuring 11 x 11 x 1.05 mm. Devices feature 100 MHz ARM® Cortex-M3(TM) 32-bit microcontroller sub-system with up to 500 K gates of FPGA. Available in commercial and industrial temperature grades as well as leaded and lead-free packages, SmartFusion® cSoCs...

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Agricultural & Farming Products

Customizable SoCs come in chip scale packages.

Catering to miniaturization needs of embedded systems, SmartFusionÂ-® cSoC Series is available in CS288 288-ball chip scale package measuring 11 x 11 x 1.05 mm. Devices feature 100 MHz ARM® Cortex-M3(TM) 32-bit microcontroller sub-system with up to 500 K gates of FPGA. Available in commercial and industrial temperature grades as well as leaded and lead-free packages,...

Read More »
Electrical Equipment & Systems

Microsemi Unveils 65-nm Embedded Flash Platform

-- All Devices to Converge on Jointly Developed UMC 65-nm eFlash Technology -- New IP Friendly Architecture Offers More Functionality, Lower Power Consumption -- Company Offers Sneak Peek at Next-Generation FPGAs for Space IRVINE, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that its...

Read More »
Electrical Equipment & Systems

Microsemi Unveils 65-nm Embedded Flash Platform

-- All Devices to Converge on Jointly Developed UMC 65-nm eFlash Technology -- New IP Friendly Architecture Offers More Functionality, Lower Power Consumption -- Company Offers Sneak Peek at Next-Generation FPGAs for Space IRVINE, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that its...

Read More »
Agricultural & Farming Products

RF Power MOSFET operates at dc voltages up to 165 V.

Housed in flangeless T3 package, Model ARF475FL uses 2 die configured for push-pull operation and is capable of 1,000 W pulsed output and 300 CW at up to 150 MHz. To obtain high power dissipation, backside of package is lapped to mate with system heat sink. Coplanar lead arrangement facilitates circuit layout and provides over 2,500 V isolation between any terminal and mounting surface....

Read More »
Agricultural & Farming Products

RF Power MOSFET operates at dc voltages up to 165 V.

Housed in flangeless T3 package, Model ARF475FL uses 2 die configured for push-pull operation and is capable of 1,000 W pulsed output and 300 CW at up to 150 MHz. To obtain high power dissipation, backside of package is lapped to mate with system heat sink. Coplanar lead arrangement facilitates circuit layout and provides over 2,500 V isolation between any terminal and mounting surface....

Read More »
Electrical Equipment & Systems

Microsemi Strengthens Radiation-Hardened Aerospace Products Portfolio

Delivers Industry's First 120V Input, 50W High-reliability DC-DC Converter Modules ALISO VIEJO, Calif., Nov. 1, 2011 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it strengthened its portfolio of radiation-hardened products with the industry's first family of 120 volt, 50...

Read More »
Electrical Equipment & Systems

Microsemi Strengthens Radiation-Hardened Aerospace Products Portfolio

Delivers Industry's First 120V Input, 50W High-reliability DC-DC Converter Modules ALISO VIEJO, Calif., Nov. 1, 2011 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it strengthened its portfolio of radiation-hardened products with the industry's first family of 120 volt, 50...

Read More »
Agricultural & Farming Products

Customizable SoCs come in chip scale packages.

Catering to miniaturization needs of embedded systems, SmartFusion-® cSoC Series is available in CS288 288-ball chip scale package measuring 11 x 11 x 1.05 mm. Devices feature 100 MHz ARM® Cortex-M3(TM) 32-bit microcontroller sub-system with up to 500 K gates of FPGA. Available in commercial and industrial temperature grades as well as leaded and lead-free packages, SmartFusion® cSoCs...

Read More »
Agricultural & Farming Products

Customizable SoCs come in chip scale packages.

Catering to miniaturization needs of embedded systems, SmartFusionÂ-® cSoC Series is available in CS288 288-ball chip scale package measuring 11 x 11 x 1.05 mm. Devices feature 100 MHz ARM® Cortex-M3(TM) 32-bit microcontroller sub-system with up to 500 K gates of FPGA. Available in commercial and industrial temperature grades as well as leaded and lead-free packages,...

Read More »
Company News

Space Forum 2011 Kicks off in Los Angeles

IRVINE, Calif., Dec. 2, 2010 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that Space Forum 2011, formerly known as the Actel Space Forum, kicks off today in Los Angeles, California. With more than 100 registered attendees, this invitation-only event has drawn system designers from the country's...

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Company News

Space Forum 2011 Kicks off in Los Angeles

IRVINE, Calif., Dec. 2, 2010 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that Space Forum 2011, formerly known as the Actel Space Forum, kicks off today in Los Angeles, California. With more than 100 registered attendees, this invitation-only event has drawn system designers from the country's...

Read More »
Electrical Equipment & Systems

Microsemi Unveils 65-nm Embedded Flash Platform

-- All Devices to Converge on Jointly Developed UMC 65-nm eFlash Technology -- New IP Friendly Architecture Offers More Functionality, Lower Power Consumption -- Company Offers Sneak Peek at Next-Generation FPGAs for Space IRVINE, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that its...

Read More »
Electrical Equipment & Systems

Microsemi Unveils 65-nm Embedded Flash Platform

-- All Devices to Converge on Jointly Developed UMC 65-nm eFlash Technology -- New IP Friendly Architecture Offers More Functionality, Lower Power Consumption -- Company Offers Sneak Peek at Next-Generation FPGAs for Space IRVINE, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that its...

Read More »
Agricultural & Farming Products

RF Power MOSFET operates at dc voltages up to 165 V.

Housed in flangeless T3 package, Model ARF475FL uses 2 die configured for push-pull operation and is capable of 1,000 W pulsed output and 300 CW at up to 150 MHz. To obtain high power dissipation, backside of package is lapped to mate with system heat sink. Coplanar lead arrangement facilitates circuit layout and provides over 2,500 V isolation between any terminal and mounting surface....

Read More »
Agricultural & Farming Products

RF Power MOSFET operates at dc voltages up to 165 V.

Housed in flangeless T3 package, Model ARF475FL uses 2 die configured for push-pull operation and is capable of 1,000 W pulsed output and 300 CW at up to 150 MHz. To obtain high power dissipation, backside of package is lapped to mate with system heat sink. Coplanar lead arrangement facilitates circuit layout and provides over 2,500 V isolation between any terminal and mounting surface....

Read More »

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