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Interior Adhesives target passenger vehicle applications.
Consisting of one-component, waterborne laminating adhesive, AQUENCEÃ-® PL 5101™ simplifies production by eliminating need to mix components, while curing on-command through heat activation. TECHNOMELTÃ-® AS 8383™, consisting of non-reactive APAO hot melt, offers multi-functional application capabilities, with effectiveness on various substrates, including acrylonitrile butadiene...
Read More »Henkel Solder and Thermal Innovations Earn Industry Recognition
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Ã- Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its LoctiteÃ-® GC 3W and Gap PadÃ-® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...
Read More »Conductive Die Attach Films suit leadframe applications.
Ablestik C100 series conductive die attach films include Ablestik C130 formulation with 30 micron thickness and Ablestik C115 with 15 micron thickness. Suitable for use with die sizes ranging from 1 x 1 mm up to 6 x 6 mm for package types including QFNs and QFPs, films provide optimal wetting ability with lower bonding temperature for stable adhesion strength. This enables adhesion against...
Read More »Halogen-Free Adhesives suit assembly of handheld electronics.
LoctiteÃ-® line of halogen-free adhesives and sealants are formulated to contain less than 900 ppm bromine and chlorine as well as 1,500 ppm total halogens. Product range includes cyanoacrylates, light cure cyanoacrylates, epoxies, urethanes, UV acrylics, silicones, hot melts, two-part acrylics, and anaerobics used for bonding, sealing, gasketing, and mounting range of components. All meet...
Read More »Henkel Corporation, Curtis Packaging and Flint Group to Present Ink and Coating Options at Sustainable Packaging Coalition Spring Meeting
FEBRUARY 25, 2009 Bridgewater, NJ - Experts from Henkel Corporation, Curtis Packaging and Flint Group will present more sustainable ink and coating options at the Sustainable Packaging Coalition spring meeting in Chicago on March 24. Adhesives, inks and coatings are less understood packaging materials than primary substrates, such as aluminum, fiber, glass and plastics, said Isabelle Valois,...
Read More »Solvent-Based Sealant cures in 30 minutes.
Formulated for use on FPR, epoxy, and composite mold surfaces, FrekoteÃ-® FMS-100(TM) solvent-based sealer is used to seal new molds and repair microporosity in older molds. High performance sealant is hand-applied in thin, even coat at room temperature. Available in 1 pint and 1 and 5 gal containers, it contains no CFCs and is shelf-stable for 12 months from date of manufacture.
Read More »Henkel Achieves Major Milestone with Launch of New AQUENCE(TM) Brand
Corrosion Protection Coating Technology Spans Globe with New Name MADISON HEIGHTS, Mich., Jan. 30 /-- Henkel proudly announces AQUENCE(TM) as the brand name of its innovative autodeposition coating technology. This water-based technology recently set new industry precedent by displacing conventional metal pretreatment and the electrocoat process for an entire automotive vehicle body. With...
Read More »Henkel's Loctite-® 3508 Cornerbond(TM) Underfill Secures Two Industry Honors
Just launched in February of this year, Henkel's new Cornerbond(TM) underfill system is already collecting industry accolades and customer kudos. The new material, LoctiteÃ-® 3508, was recently honored with two prestigious industry awards presented during the Nepcon China/EMT China event, held April 23 - 27 in Shanghai. Henkel began the week with the acceptance of an inaugural SMT China...
Read More »Plastics Cleaner is effective at 110-
Specially formulated for cleaning plastic surfaces, P3Ã-® PolyprepÃ-® 110(TM) cleaner is solvent- and phosphate-free, combining effective cleaning properties with lower operating temperature. P3Ã-® PolyprepÃ-® 110(TM) is effective at temperatures as low as 110Ã-
Read More »Underfill Material enables recovery of substrates and PCBs.
Manufactured in lead-free environments, LoctiteÃ-® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing...
Read More »Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018
High-visibility masking material, low-voiding and jetting solder pastes on display Coming off a historic 2017 during which the electronics business of Henkel Adhesive Technologies launched over 50 new products and enjoyed significant sales wins, the company is poised to have a repeat performance this year. At IPC APEX Expo in San Diego, CA, the Henkel team will showcase a host of new products in...
Read More »Interior Adhesives target passenger vehicle applications.
Consisting of one-component, waterborne laminating adhesive, AQUENCEÃ-® PL 5101™ simplifies production by eliminating need to mix components, while curing on-command through heat activation. TECHNOMELTÃ-® AS 8383™, consisting of non-reactive APAO hot melt, offers multi-functional application capabilities, with effectiveness on various substrates, including acrylonitrile butadiene...
Read More »Henkel Solder and Thermal Innovations Earn Industry Recognition
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Ã- Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its LoctiteÃ-® GC 3W and Gap PadÃ-® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...
Read More »Henkel-Sponsored Athlete Prevails to Win 5th X Games Gold
Award-Winning Prosthetic Leg Design and LoctiteR Adhesives Support MikeÃ- Schultz's Victory in Adaptive Motocross Rocky Hill, Conn.Ã- – Henkel-sponsored adaptive athleteÃ- Monster Mike Schultz showcased his athletic prowess and self-taughtÃ- engineering skills when he took home the gold in the Moto X Adaptive Final at X Games Los Angeles 2013 on August 3. Throughout the...
Read More »Golden Boys: Henkel Athletes Win Big at X Games Aspen 2013
LoctiteÃ-® Adhesives Help Schultz Three-peat Adaptive Snocross and LaVallee Win Back-to Back Gold Rocky Hill, Conn. - At X Games Aspen 2013, Henkel-sponsored athletes Monster Mike Schultz and Levi LaVallee struck gold in dramatic fashion. Not once. Not twice. But three times. For both extreme athletes, LoctiteÃ-® adhesives and sealants played critical roles in keeping their snowmobiles in...
Read More »Henkel Announces Results of 2011 Bonneville Land Speed Racing
WORLD RECORDS BROKEN AT LOCTITE(r)-SPONSORED COOK'S BONNEVILLE SHOOTOUT Rocky Hill, Conn. -- October 27, 2011... The fastest vehicles in the world gathered on the Bonneville Salt Flats in Utah last month, racing against time to beat existing world land speed records. But 2011 was a year of heartbreak -- most teams returned home with broken vehicles rather than broken records. Four teams drove...
Read More »Henkel Updates Loctite-® Structural Adhesive Selector Guide
Light-Hearted Literature Overviews Benefits of Structural Adhesives vs. Traditional Fastening Methods Rocky Hill, Conn. -- September 22, 2011... To communicate structural adhesives' ability to eliminate or greatly reduce fasteners and welds from an assembly while improving strength and durability, Henkel Corporation has introduced its updated LoctiteÃ-® Structural Adhesives Selector Guide....
Read More »Henkel Keeps Fans Connected as World's Fastest Vehicles Race to Break Land Speed Records
Live Coverage of LoctiteÃ-®-Sponsored 2011 Cook's Bonneville Shootout Starts September 19 Rocky Hill, Conn. -- September 7, 2011... On September 19 through 23, the fastest cars and motorcycles in the world will be racing against time on the Bonneville Salt Flats in Utah, hoping to break existing world land speed records. This year, Henkel will make it very easy for fans to follow the emotion...
Read More »Loctite-® Sponsors No. 36 Car at Indianapolis 500
Driver Pippa Mann First-Ever British Female to Enter 100-Year-Old Race Rocky Hill, Conn. -- May 26, 2011... When the green flag drops at the 100th Anniversary Indianapolis 500 race at noon on Sunday, racing fans will actually be able to see LoctiteÃ-® at work on the track. Henkel Corporation has announced that LoctiteÃ-® brand adhesives -- products that have enhanced automotive...
Read More »Conductive Die Attach Films suit leadframe applications.
Ablestik C100 series conductive die attach films include Ablestik C130 formulation with 30 micron thickness and Ablestik C115 with 15 micron thickness. Suitable for use with die sizes ranging from 1 x 1 mm up to 6 x 6 mm for package types including QFNs and QFPs, films provide optimal wetting ability with lower bonding temperature for stable adhesion strength. This enables adhesion against...
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