Company News

DEK International GmbH

Geroldstrasse 28, Zurich, Ch-8005, Switzerland

  • +41 1 274 80 20

General Information:
Laura Sims
USA
Phone: 770-829-4757
E-mail this person

Latest New Product News from
DEK International GmbH

computer hardware & peripherals, printing & duplicating equipment, green & clean

Electronics Printing Platform increases ouput capacity.

April 23, 2014

Based on Horizon iX series, Gemini enables high-volume electronics manufacturers to increase output while ensuring accuracy, quality, and yield. This back-to-back (B2B) printing system, delivering modular processing on-demand, features GUI for usability, can manage 508 x 508 mm print area in industry standard frame, and produces as many as 300 boards/hr. Independent functionality allows one printer to continue running while managing product changeover on other. Read More

computer hardware & peripherals

Stencil Solution meets ultra fine-pitch printing demands.

March 12, 2009

Micro-engineered to meet challenges of fine-pitch printing, VectorGuard® Platinum provides semiconductor manufacturers with platform suited for applications such as wafer level packaging, direct chip attach, flip chip, and ball grid arrays. It delivers aperture accuracies of less than 3 µm and positional tolerances of better than 20 µm at pitches down to 50 µm. Also, optimal process efficiency is ensured by generating accurate paste transfer and consistent paste volume repeatability. Read More

material handling & storage

Dual Lane PCB Conveyor boosts throughput and flexibility.

November 3, 2008

Utilizing core cycle time of 4 sec, Europa Dual Lane RTC (Rapid Transit Conveyor) lets manufacturers double their throughput with parallel processing on 2 lanes. It combines dual lane and board transport technologies with mass imaging platform to promote true continuous printing and ongoing productivity. Having dual lane machines configured for front printing or rear pass-through facilitates line-out, eliminates ancillary handling equipment, and maximizes floor utilization. Read More

computer hardware & peripherals, printing & duplicating equipment

Reel-to-Reel Printer aids continuous substrate manufacture.

October 23, 2007

Dedicated R2R (Reel-to-Reel) solution enables precision printing on continuous substrates up to 150 m long and 500 mm wide, such as flexible printed circuits and advanced synthetic materials. Precision screen printing enables manufacturers to deposit advanced materials onto flexible substrates directly from reel. Printer offers repeatable motion-control and substrate-clamping techniques that enable step-and-repeat sequences for optimal control and minimal waste. Read More

machinery & machining tools

Automated Tooling System handles high-density boards.

September 11, 2007

Able to support entire PCB assembly, HD Grid-Lok® requires minimal intervention from line operator and eliminates delay associated with dedicated tooling fixture configuration. Tooling fixture is activated via one button, and 12 mm pin pitch can be set-up in seconds to provide complete, flexible board support. Based on a modular foundation concept, solution will conform to any given board profile and can be reset in seconds for all subsequent boards. Read More

vision systems

Imaging System manages materials for packaging applications.

July 23, 2007

Comprised of scalable materials management cartridges, ProFlow(TM) enclosed head deposition system, and Europa printing platform, M3i offers programmable ratio mix control and imaging of variety of materials. System can be used for underfill and encapsulation as well as solar cell and fuel cell imaging. Since M3i operates in real-time and is fully automated and programmable, errors introduced by operator intervention are eliminated. Read More

material handling & storage

Panel Carrier facilitates substrate centering and transport.

July 23, 2007

Consisting of base carrier with consumable foil, Virtual Panel Carrier enables multiple component support and alignment during screen printing and all subsequent assembly processes. Substrates are held in carrier via 4-sided tensioning mechanism and then aligned within carrier using centering system. Parts are referenced using two global fiducials, enabling transfer of VPC throughout all assembly processes. Read More

computer hardware & peripherals, machinery & machining tools

Mass Imager performs singulated substrate processing.

August 31, 2006

SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms enable processing times of 20 sec and less for individual parts, depending on process. Read More

test & measuring instruments

PCB Inspection System features four-second cycle time.

January 31, 2006

RTC(TM) (Rapid Transit Conveyor) system incorporates HawkEye(TM) technology, which utilizes inspection philosophy that isolates faults through good/bad verification and can verify 100% of printed boards within line beat rate by analyzing streamed images. System grips board, adapts to its dimensions, and transports it into printing position, resulting in 4 sec core cycle time. To isolate bad boards, system records pass/fail per board against preset thresholds. Read More

machinery & machining tools

Backside Wafer Coating is enabled by mass imaging platform.

August 10, 2005

High-throughput backside wafer coating process is capable of exceeding the ±12.5 µm Total Thickness Variation (TTV) required by wafer processing specialists. Process, compatible with underfill or adhesive-type coatings normally applied to backside of semiconductor wafers prior to singulation, is also compatible with company's metal stencil and emulsion screen technologies. Read More

labels, tags, signage & equipment, materials & material processing, printing & duplicating equipment

Products and Services offer comprehensive lead-free solution.

June 15, 2005

DEK Lead-Free(TM) Branded products include stencils for lead-free solder paste, squeegees and cleaning materials, lead-free stencil storage, and lead-free Printer Caddy. Formalized approach to implementing lead-free pre-placement begins with focused process audit and Site Implementation Plan methodology. Tutored workshop sessions are provided with unlimited Q and A, allowing customers to gain hands-on experience with lead-free materials and processes. Read More

printing & duplicating equipment, software

System offers board-level traceability for screen printing.

April 28, 2005

Setup Verification and Traceability tool includes software and hardware to identify stencil, paste, and other setup variables as screen printing machine is prepared. Verification feature compares actual values with those specified in product file, and can be programmed to halt machine or generate warning in event of error. Software supports 1D and 2D barcodes, and all data is recorded for analysis in formats compatible with packages such as Microsoft® Excel. Read More

labels, tags, signage & equipment, software

Software and Stencils facilitate lead-free printing.

April 19, 2005

Suited for continuous screen printing in SMT applications, Europa and Horizon printing platforms integrate Instinctiv user interface for interpretation of complex process information and on-board recovery. VectorGuard(TM) versions of stencil technologies, including PumpPrint(TM) and electroformed stencils, as well as stainless steel laser cut stencils, are safe to use on factory floor, store in space-efficient filing system, and disassemble at end of life. Read More

controls & controllers, software

Software delivers complete machine control.

December 2, 2004

Suited for electronics manufacturers, ISCAN(TM) Intelligent Scaleable Control Area Network architecture is based on Fieldbus technology, which transmits packets of information digitally. Intelligent communication allows for trend analysis, which can monitor overall machine health and predict routine maintenance. All information is additionally accessible remotely via Internet using Interactiv(TM) system. Read More

software

User Interface optimizes machine utilization.

November 8, 2004

Available on Micron-class Galaxy and Europa platforms, Instinctiv(TM) machine user interface draws on human factor techniques to display machine and process data. It also acts as portal to content-rich technical support services via Internet. Graphical techniques, TimeToGo real-time indication of consumables levels, and on-board help and error recovery allow operators to maximize uptime and assess and optimize complex processes. Read More

computer hardware & peripherals

Semi-Automatic Printers have full-screen user interface.

October 21, 2004

Equipped with 3.5 in. floppy disk drive, DEK 248 printers feature PC-based user interface that lets operators view all machine parameters to aid in accurate machine control. When used with keyboard with integrated trackball, interface also aids in editing parameters; moving, storing, and backing-up product files; and accessing context-sensitive help. Along with simplified language selection, interface also supports printer's optional vision capabilities. Read More

machinery & machining tools

Assembly Machine is designed for SMT pre-placement.

August 11, 2004

For true paste on pad repeatability, Europa features cycle time under 7 sec and total process Cpk 2.0 at ± 20 µm. Its DEK Instinctiv user interface, with graphical TimeToGo indications for consumable replenishment, provides on-board help and error recovery. Chassis offers torsional and thermal stability as well as single natural vibration frequency. Scaleable control system utilizes CAN technology, and Hawkeye post print vision system provides 100% print verification. Read More

machinery & machining tools

Wafer Coating Process is hosted on mass imaging platform.

July 28, 2004

Capable of exceeding ±12.5 mm Total Thickness Variation stipulated by wafer processing specialists, backside wafer coating process is compatible with underfill or adhesive-type coatings normally applied at nominal 50 mm thickness to backside of semiconductor wafers ahead of singulation. Process is also compatible with metal stencil and emulsion screen technologies, which enable materials with larger filler particles to be applied with smooth surface finish. Read More

Other Company News from
DEK International GmbH

November 15, 2005

DEK